DWDM Tb Photonics Integrated Circuit for Continuous Readout

Award: DE-SC0019581
Program Manager for Industrial Concepts: Dr. Michelle D. Shinn
Program Manager of Advanced Technology R&D: Dr. Manouchehr Farkhondeh
Principal Investigator: Radu Radulescu, Telluric Labs LLC
Subcontractor: MIT Lincoln Lab
DOE SBIR STTR Exchange Meeting 2022: August 24, 2022

TTDAQ Readout Network Specifications


  • Radiation-hardened
  • Triggerless, continuous readout for software-driven detectors
  • Photonic Integrated Circuit (PIC) modulator interfaced directly to sensor preamplifiers
  • Terabit bandwidth per fiber with up to 64 DWDM channels (100G ITU grid; limited to 32 by foundry PDK with FSR of 3.2THz)
  • Analog and digital signal transport
  • GTS protocol enables non-intrusive, in-band timing synchronization over COTS packet networks without hardware timing distribution
  • FPGA-based picosecond TDC for both detector signals and network packets at backend electronics
  • High modulation power efficiency

PIC Design Components:

  • Prometheus Chiplet: 12 differential channels or 24 single-ended, daisy-chainable for 24/48 channels
  • Phoenix Chiplet: 16 differential 25GE channels, daisy-chainable for 32 channels
  • Pebbles Chiplet: For testing individual subsystems

Development: Created in partnership with MIT LL
and manufactured at AIM Photonics

Telluric Labs

RUN 1

Telluric Labs

RUN 2

Pebbles Chiplet Basic circuits with new MRR designs

Telluric Labs
Telluric Labs
Telluric Labs

Prometheus Chiplet 12 differential channels on 200G ITU grid, expandable with another
PIC for 24 channels on 100G ITU grid

Telluric Labs
Telluric Labs

Advantages of DWDM Tb PIC Benefits:

  • Reduced installation, commissioning, and maintenance costs for nuclear physics experiments
  • Parallel experiments with independent filtering/software trigger using COTS FPGA accelerator boards
  • Cost savings for front-end (FE) and cooling systems, enabling lighter detector structures
  • Passive Optical Networks (PON) provide scalability and flexibility
  • Uses microring resonator technology, enabling channel multiplexing with minimal power consumption
  • DWDM signal transmission over miles without amplification
  • Double/multiple redundancy for laser or resonator failures
  • PIC size approximately 4x2mm, integrating well with ASICs on pixel array sensors
  • 30+ Gbaud/s per channel
  • Radiation tolerant as lasers are external, enhancing stability and control

Modulation Techniques Types:

Amplitude Modulation
Phase Modulation using microring resonators with add-drop topology, RAMZI MRR modulation (~10GHz/V)
Functional parameters: laser wavelength/power, heater control, DC bias, RF signal amplitude

Telluric Labs
Telluric Labs

Differential Modulation

Phase modulation with π RAMZI – detailed modulation principle available at:
https://ieeexplore.ieee.org/document/8540485

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Measurements and Testing

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Telluric Labs
Telluric Labs

Bench Measurements:

Run 1: MicroRing optical characteristic, Free Spectral Range (FSR) = 3.2 THz

Telluric Labs

Eye Diagram Analysis:

Single-ended microring resonator measurement vs. simulation
Differential modulator analysis with interferometer transmission comparison

Telluric Labs
Telluric Labs
Telluric Labs
Telluric Labs
Telluric Labs

DWDM Tb Photonics Integrated Circuit for
Continuous Readout Architecture

Components:
Direct analog interface, splitter, and in-band synchronization using FPGA, ETDC, NIC
Multiple packaging challenges addressed, including optical alignment, fiber array testing, and fine pitch PCB bonding

Telluric Labs

Packaging technologies Multiple challenges

  • Optical alignment
  • Fiber array (12 fibers ) for testing several entry/exit points from the PIC
  • Electrical contacts
  • At 100um pitch, double-row pads
  • Could not use traditional interposers due to cost and fabrication time
  • Direct-to-PCB technology requires new solutions
  • Precision feature - PCB fabrication and PIC placement
  • Assembly temperature
  • Stability in time of bonding
  • Rework
  • Impedance matching (including embedded resistors)
  • > 15GHz
  • Cross talk
  • RF and thermal

Project Impact on Electro-Optics

High-density PIC component integration
Direct fine-pitch PCB bonding replaces traditional wire bonding
Anisotropic Conductive Adhesives and fine-pitch RF PCB innovations

Radiation Hardness Testing Testing Components:

5V coaxial power, BNC boards, MOD1 and MOD2 modules with heaters, and integrated power monitoring

Telluric Labs
Telluric Labs
Telluric Labs
Telluric Labs
Telluric Labs

Next Steps

  • Conduct radiation impact comparison tests on PIC
  • Test Pebbles with GSGSG probes
  • Build and test Phoenix channels, including wavelength tuning and eye diagram analysis
  • Develop test boards with AI controls, FPGA BERT, TIA, and driver VITA 57.4 boards

Contact Information